S7045GH
特點
● 高Tg＞170℃ (DSC)，無鹵材料
● 低插損，Dk/Df @1GHz: 3.95/0.0095
● 更低的Z軸熱膨脹系數
應用領域
● 服務器、交換機、基站和線卡- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
190 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 415 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
| After Tg | ppm/℃ | 245 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
PASS |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.15 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 3.95 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0080 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 0.0095 | ||
|
Peel Strength (1oz copper foil) |
After thermal Stress 288℃,10s | N/mm | 1.0 | ||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
Remarks:
Remarks:
1. Meet IPC-4101/130 specification sheet.
2. All the typical value is based on the 0.76mm (6*2116)specimen, but not guarantee data.
3. All the typical values listed above are for yourreference only and not intended for specification. Please contact ShengyiTechnology Co., Ltd. for detailed information. All rights from this data sheetare reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning,D=Immersion conditioning in distilled water, E=Temperature conditioning. Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.