產(chǎn)品與市場(chǎng)
S1190G
特點(diǎn)
● 優(yōu)異的耐CAF性能，耐高壓性能
● 高Tg 200℃(DMA)
● 較低的Z軸膨脹系數(shù)
● 優(yōu)異的耐熱性
● 不含鹵素、銻、紅磷等成分
應(yīng)用領(lǐng)域
● 厚銅電源
● 電源模組
● 高電壓應(yīng)用產(chǎn)品
● 工控和醫(yī)療電子
- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 190 | |
|
IPC-TM-650 2.4.24 |
TMA |
℃ |
180 | ||
|
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
200 | ||
| Td | IPC-TM-650 2.4.24.6 | TGA(5% wt. loss) | ℃ | 408 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
| After Tg | ppm/℃ | 180 | |||
| 50-260℃ | % | 1.8 | |||
| CTE (X/Y-axis) | IPC-TM-650 2.4.25 | Before Tg | ppm/℃ | 11/13 | |
|
T260 (With Cu) |
IPC-TM-650 2.4.24.1 |
TMA | min | >60 | |
| T288 (With Cu) | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃/10s/6cycles, solder dip | - | Pass | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 6.0 x 108 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 |
C-96/35/90 |
MΩ | 8.0 x 107 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 181 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+KV NB | |
|
Dissipation Constant (Dk) RC52% |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.3 | |
| Dissipation Factor (Df) RC52% | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.011 | |
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm | 1.3 | |
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 560 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.11 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
Remarks:
1. All the typical value is based on the 1.6mm(8*7628) specimen. The Dk and Df value is based on 50% RC.2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.