產(chǎn)品與市場(chǎng)
SF325B
特點(diǎn)
● 粘接強(qiáng)度高。
● 不含鹵素，阻燃性達(dá)到UL94 VTM-0級(jí)。
● 優(yōu)秀的耐熱性、耐化學(xué)性和電性能。
● 優(yōu)異的耐離子遷移性，不長(zhǎng)枝狀結(jié)晶。
● 溢膠量低，加工性好，適于快速壓合和傳統(tǒng)壓合。
● 滿(mǎn)足RoHS指令要求，不含鉛、汞、鎘、六價(jià)鉻、多溴聯(lián)苯、多溴聯(lián)苯醚等。
應(yīng)用領(lǐng)域
多層撓性印制板和剛撓性印制板等用粘接膜- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.7 |
| 288℃, 5s | 1.6 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
96.2 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
8.0×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
8.5×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.4 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.017 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm |
＜0.15 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
VTM-0 |
Remarks:
*Testing after laminating with shining side of copper foil and PI film insuitable condition.
1.Certified to IPC-4203/20 Unsupportedpolyester adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.